HWANG TYNG LIH <br/><br/>
3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY 

 - 1ST 
 -  JOHN WILEY & SONS INC  2018 
 - 423P. 
<br/><br/><label>ISBN: </label>978119289647 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELCTRONICS
<br/><br/><label>Dewey Class. No.: </label>621.395 HWA