TY  - BOOK
AU  - HWANG TYNG LIH
AU  - SHENG TZYY JASON HORNG
TI  - 3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY
SN  - 978119289647
U1  - 621.395 HWA 
PB  - JOHN WILEY & SONS INC
KW  - ELCTRONICS
ER  -