3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY (Record no. 87569)

MARC details
000 -LEADER
fixed length control field 00494nam a2200193Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 240112s9999 xx 000 0 und d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 978119289647
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.395 HWA
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name HWANG TYNG LIH
245 #0 - TITLE STATEMENT
Title 3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY
250 ## - EDITION STATEMENT
Edition statement 1ST
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. JOHN WILEY & SONS INC
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Date of publication, distribution, etc. 2018
300 ## - PHYSICAL DESCRIPTION
Extent 423P.
365 ## - TRADE PRICE
Price amount 13252
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ELCTRONICS
700 ## - ADDED ENTRY--PERSONAL NAME
Personal name SHENG TZYY JASON HORNG
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Reference
Holdings
Date last seen Total Checkouts Full call number Barcode Cost, normal purchase price Cost, replacement price Price effective from Koha item type Public note Lost status Damaged status Not for loan Withdrawn status Bill No Bill Date Home library Current library Date acquired Source of acquisition
17/01/2024   621.395 HWA 65859 13252.00 13252.00 12/01/2024 Reference ELCTRONICS         58 12/16/2023 VIT Central Library VIT Central Library   CHENNAI BOOK AGENCY