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3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY

By: Contributor(s): Material type: TextTextPublication details: JOHN WILEY & SONS INC; 2018Edition: 1STDescription: 423PISBN:
  • 978119289647
Subject(s): DDC classification:
  • 621.395 HWA
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Holdings
Item type Current library Call number Status Notes Date due Barcode
Reference VIT Central Library 621.395 HWA (Browse shelf(Opens below)) Not for loan ELCTRONICS 65859

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