3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY
Material type: TextPublication details: JOHN WILEY & SONS INC; 2018Edition: 1STDescription: 423PISBN:- 978119289647
- 621.395 HWA
Item type | Current library | Call number | Status | Notes | Date due | Barcode | |
---|---|---|---|---|---|---|---|
Reference | VIT Central Library | 621.395 HWA (Browse shelf(Opens below)) | Not for loan | ELCTRONICS | 65859 |
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