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3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY

By:

HWANG TYNG LIH

Contributor(s):

SHENG TZYY JASON HORNG

Material type: Text

Text

TextPublication details: JOHN WILEY & SONS INC; 2018Edition: 1STDescription: 423PISBN:

978119289647

Subject(s):

ELCTRONICS

DDC classification:

621.395 HWA

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Holdings
Item type	Current library	Call number	Status	Notes	Date due	Barcode
Reference	VIT Central Library	621.395 HWA (Browse shelf(Opens below))	Not for loan	ELCTRONICS		65859

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Previous	621.395 HOS HIGH PERFORMANCE ASIC DESIGN USING SYNTHESIZABLE DOMINO LOGIC IN AN ASIC FLOW	621.395 HU CMOS HIGH EFFICIENCY ON-CHIP POWER MANAGEMENT	621.395 HUI OPERATIONAL AMPLIFIERS : THEORY AND DESIGN	621.395 HWA 3D IC AND RF SIPS ADVANCED STACKING AND PLANAR SOLUTIONS FOR 5G MOBILITY	621.395 IBR INTRODUCTION TO APPLIED FUZZY ELECTRONICS	621.395 ISH LOW POWER AND RELIABLE SRAM MEMORY CELL AND ARRAY DESIGN	621.395 ITO ULTRA HOW VOLTAGE NANO-SCALE MEMORIES	Next

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